create an image that represents the following: 1. Core Brain Unit (CHU): o Processor: High-performance ARM SoC (e.g., Qualcomm Snapdragon, NXP i.MX) with integrated NPU/AI accelerator (e.g., >10 TOPS). o Memory: 4GB-8GB LPDDR5 RAM; 64GB-128GB eMMC/NVMe storage (expandable via M.2 NVMe slot for user-supplied SSD). o Connectivity: Wi-Fi 6E/7 (Dual-band/Tri-band, Mesh capable), 5G/LTE Modem (Sub-6 GHz, mmWave optional) with eSIM, Bluetooth 5.x (LE, Audio), Zigbee, Z-Wave, Thread, Matter Border Router, NFC, UWB. o Wired Ports (via Universal I/O Module): HDMI 2.1 (eARC, VRR, ALLM), 2x USB-C (PD), Ethernet (RJ45), S/PDIF Optical, RCA Stereo. o Security: Dedicated Secure Element (SE) / TPM, Hardware-Rooted Trust, Secure Boot, Physical Tamper Detection. o Power: 12V/3A DC input, integrated PMU, support for Battery Module. o Dimensions: Compact form factor, modular connectors for exoskeleton. 2. Audio Output Module (Modular Speakers): o Types: Tweeter Module: Dedicated module with 1" dome tweeter, integrated amplifier. Midrange Module: Dedicated module with 2-3" cone driver, integrated amplifier. Full-Range Module: Dedicated module with 2-3" full-range driver, integrated amplifier (for Mini-Nodes or smaller setups). Bass Module: Dedicated module with 4-5" woofer, integrated amplifier. Subwoofer Module: Standalone wireless unit with 6-8" long-throw driver, dedicated amplifier (e.g., 100-200W RMS). o Audio Features: DSP-tuned, multi-room audio sync, acoustic calibration mic. See more