Exploded isometric view of smartphone internal layers with snowflake, tree-branch, wave, spiral, and honeycomb designs in a patent illustration style.

Large exploded cutaway of a smartphone showing a NON-STANDARD internal architecture. The phone interior is ENGINEERED by geometry, not decoration. TOP LAYER: A rectangular processor chip sits at the top, mounted on a rigid plate. Beneath it is a CLEARLY DEFINED SNOWFLAKE-SHAPED DISTRIBUTION HUB that splits power and data evenly. MIDDLE LAYER: Power rails and data buses do NOT use straight PCB traces. They use TREE-BRANCH GEOMETRY, with thick trunks near the chip and thinner branches spreading outward. THERMAL LAYER: Below all electronics is a FULL-WIDTH WAVE-SHAPED THERMAL PLATE running end-to-end, visibly separate from the PCB. EDGE STRUCTURE: Along the phone edges are SPIRAL AND HELIX CHANNELS acting as antenna and signal paths. FRAME: The internal chassis uses a CELLULAR / HONEYCOMB LATTICE for strength and vibration control. Each geometry is LARGE, FUNCTIONAL, and OCCUPIES ITS OWN PHYSICAL ZONE. This is NOT a normal smartphone PCB. Ultra-realistic engineering visualization, exploded layers clearly separated, patent illustration style. See more